Dual Interface Module Preparation
- Leveling Solder Bump
- Glue Tape
The first step in the direct-solder process is the preparation of the dual interface modules.
Our fully automated MPM-01 prepares modules while still in tape form by first ‘tinning’ or pre-soldering the antenna connection pads.
This tinning process leaves a solder bump on the antenna pads which is milled to a consistent height for precise attachment of the antenna leeds. Traditional hot-melt glue tape is applied in the same production pass.