Back of Card Spot Pressure

Test FixtureThe TM-423 measures the amount of force required to push a smart card module from it's card body by applying pressure to the back of the module. This is done by first drilling a 6mm diameter cavity in the ca=rd body, directly behind the IC module, using the TM-423-P or similar device and then applying the force probe directly to the back of the module until it breaks free of the card body.

This fixture can also be used for the TM-B02, the embossed character relief height retention test. It's manual design and analog gauge were specifically chosen to best meet the CQM requirements and day to day lab testing.