Cavity Milling

Antenna Preparation

Direct Solder

Wire Dressing

Glue Tape Lamination

Module Embedding

ATS & ATR Testing

Developed by Cardmatix, the patented Direct-Solder process drives the production of over 500 million dual interface banking cards a year.

No other process offers the RF performance, longevity, or durability of the solder connection. A direct-solder connection does not impair RF performance, and will not decay or change with time.

This is an ideal solution for manufacturing dual interface cards for banking, secure IDs and transport.

The Direct-Solder Method is the process of soldering a copper wire antenna embedded within the card body directly to wire antenna pads on the back of the dual interface module.

Consumables: There are no hidden costs or complicated logistics associated with sourcing proprietary glues, inlays, or special module designs.

Flexibility: The direct solder process can run ten cards as economically as one million. There are no expiration dates or minimum orders quantities to consider in your pricing models.

Removable Magazines: Attach or detach magazines for easy loading and unloading of cards.