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Cardmatix was established in 2002 to focus on the manufacturing of equipment for the production and testing of contact, contactless & dual interface smart cards for the world market.
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Cardmatix was established in 2002 to focus on the manufacturing of equipment for the production and testing of contact, contactless & dual interface smart cards for the world market.
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Cardmatix was established in 2002 to focus on the manufacturing of equipment for the production and testing of contact, contactless & dual interface smart cards for the world market.
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Cardmatix was established in 2002 to focus on the manufacturing of equipment for the production and testing of contact, contactless & dual interface smart cards for the world market.

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DUET MPM-01

Dual Interface Module Preparation

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Dual Interface

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Technical Specification

Pre-Solder

Leveling Solder Bump

Glue Tape

The first step in the direct-solder process is the preparation of the dual interface modules.

Our fully automated MPM-01 prepares modules while still in tape form by first ‘tinning’ or pre-soldering the antenna connection pads.

This tinning process leaves a solder bump on the antenna pads which is milled to a consistent height for precise attachment of the antenna leeds. Traditional hot-melt glue tape is applied in the same production pass.