Cavity Milling

The WirePRO is equipped with three cavity milling stations to accurately expose the antenna for removal and then forming the final module cavity.

Antenna Preparation

Using vision controlled robotics, the antenna leads are QC checked and their location is sent to a robot picking device that pulls them from the module cavity in preparation for the bonding station.

Direct-Solder

Antenna leeds are direct-soldered to the dual interface module using thermal compression method. Module antenna pads are pre-soldered in a separate process.

Wire Dressing

The antenna leads are folded under the module in preparation for the embedding station

Module Embedding

The traditional process of embedding the module into the card body with a standard glue tape lamination process.